Intel CEO Lip-Bu Tan will visit Odisha for the semiconductor plant groundbreaking with 3DGS & SiCSem, boosting India’s chip manufacturing
OdishaPlus Bureau
Intel CEO Lip-Bu Tan, a prominent figure in the PC chip industry, is anticipated to visit Odisha later this year for the ground-breaking ceremony of the semiconductor plant operated by 3D Glass Solutions, as stated by a senior official from the state government on Wednesday.
The ground-breaking ceremony for SicSem, a silicon carbide company, is set to take place next month, with commercial chip production expected to commence in two years, according to Vishal Kumar Dev, Principal Secretary of the Odisha Electronics and IT Department, who spoke to PTI.
“Chief Minister Mohan Charan Majhi was present, and both SiCSem and 3DGS have committed to initiating the unit promptly. The ground-breaking for SiCSem will occur next month, and 3D Glass Solutions is awaiting a date from Intel CEO Lip-Bu Tan, who also intends to visit Odisha. This visit will coincide with the ground-breaking ceremony, which is hoped to take place within the next two to three months,” Dev remarked.
The semiconductor packaging unit for 3D Glass will be established by Heterogeneous Integration Packaging Solutions Pvt Ltd, which is supported by major US technology companies, including Intel, Lockheed Martin, and Applied Materials. This project involves an investment of Rs 1,943 crore and aims for an annual production capacity of 5 crore units.
This initiative marks the first semiconductor project involving Intel Corporation, a manufacturer of personal computer chips, alongside other technology partners. SicSem Private is collaborating with the UK-based Clas-SiC Wafer Fab to create an integrated facility for Silicon Carbide (SiC), which will be the country’s first Compound Semiconductor fabrication plant, located at InfoValley in Bhubaneswar.
Dev also mentioned that RIR Power Electronics has informed the Odisha Chief Minister that their SiC wafer fabrication facility, which involves an investment of Rs 618 crore, is already operational, with commercial production slated to begin in March 2026.
The Odisha government has introduced a revised semiconductor policy that provides incentives amounting to 50 percent of the total incentives offered by the central government, along with additional incentives aimed at attracting talent.
Under the newly implemented policy, the state government is providing engineering students with an incentive of approximately Rs 10,000 if they select semiconductor as one of their subjects, along with support to develop their own chips for commercial production.
In an official statement, the state government announced that it has entered into two agreements for electronics manufacturing initiatives, involving investments totaling around Rs 2,655 crore.
“On the first day (September 2), two important MoUs were signed between the Government of Odisha and prominent global firms — TopTrackHi-Tech PCB, for a Rs 1,005 crore advanced PCB manufacturing facility, and Sancode Technologies Limited, which is utilizing the expertise of its technology partners (Silicon Connect, Advanced Packaging Institute & Research Center (APIRC), and Inari Amertron Berhad) to establish a Rs 1,650 crore facility,” the statement indicated